The next two letters indicate the mechanical package type, lead finish, and operating temperature range. FBGA package, lead-free SA: Standard FBGA package variation WP: TSOP package
Verifying that the physical package markings align with the official data sheet helps confirm component authenticity. The Core Structure of a Micron Part Number
A typical Micron DRAM part number might look like this: (This is an older part number, but its format is representative). Here's how to decode it: micron memory part number decoder
Now, let's examine a few examples of Micron Flash part numbers:
When ordering, replacing, or designing hardware with Micron components, you will encounter long, complex alphanumeric strings. These strings are not random. They are highly structured part numbers that contain specific data about the component's architecture, capacity, voltage, package type, and speed. The next two letters indicate the mechanical package
It is important to distinguish between the capacity and the DRAM chip capacity.
: You can translate these codes back into full part numbers using the Micron FBGA and Component Marking Decoder . 2. Micron DRAM Part Numbering System Here's how to decode it: Now, let's examine
Manually translating Micron part numbers protects your infrastructure from unexpected downtime. By understanding how to isolate the product family, density configuration, speed grade, and die revision, you can make informed decisions during hardware procurement, testing, and troubleshooting.
: Identifying the specific die revision (e.g., "B-die" vs "E-die") which is crucial for overclocking. Do you have a specific part number 5-digit FBGA code you need help breaking down right now?
For a Micron NAND Flash part number like , the structure is different and tends to be more directly descriptive: